Chipbond

2022年12月29日

新闻提供的分享这篇文章本文全球晶圆级包装市场份额在2021年达到40亿美元的价值。展望未来,出版商希望市场到2027年将达到112亿美元,表现出2021 - 2027年期间CAGR为18.72%。记住COVID-19的不确定性,我们不断跟踪和评估的直接和间接影响大流行结束在不同的行业使用。这些见解都包含在报告作为主要市场因素。wafer-level包装巨头()是指用于包装解决方案添加一个保护层的电子连接和集成电路(ic)。用于设备,如麦克风、压力传感器、加速度计、陀螺仪、电容器、电阻和晶体管。巨头的一些常用的集成类型包括扇出(FO),扇入(FI)、倒装芯片,3 d FOWLP。wafer-level这些解决方案使用的设备,而不是晶片切割成单个模具和包装。这提供了各种福利,如降低晶片大小的芯片,简化芯片制造工艺和改进的功能。超薄晶片也提高散热性能,减少形式因素和最小功耗。 Significant growth in the electronics industry across the globe represents one of the key factors creating a positive outlook on the market growth. Furthermore, the increasing requirement for more compact and faster consumer electronics is also driving the market growth. This has also enhanced the overall demand for cost-effective and high-performance packaging solutions for enhanced mechanical protection, structural support and extended battery life of the devices. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), are acting as other growth-inducing factors. For instance, WLP is widely used for the manufacturing of radar systems in self-driving automobiles. It is also used in the healthcare sector for the production of various wearable devices. Other factors, including increasing circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market further. Competitive Landscape: The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited, IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. and Toshiba Corporation. Key Questions Answered in This Report: How has the global wafer level packaging market performed so far and how will it perform in the coming years? What has been the impact of COVID-19 on the global wafer level packaging market? What are the key regional markets? What is the breakup of the market based on the packaging type? What is the breakup of the market based on the end use industry? What are the various stages in the value chain of the industry? What are the key driving factors and challenges in the industry? What is the structure of the global wafer level packaging market and who are the key players? What is the degree of competition in the industry? Key Topics Covered: